Tom Buck - Senior Technologist - DDi

Speaker Bio:Over thirty years experience in the field of custom designed high performance electronic interconnection products designed primarily for telecommunications, high performance signal processing, and advanced military systems. Extensive experience in the design and manufacture of high speed/high density digital packaging with interconnect products including, Multi-chip Modules, high density Multilayer circuits utilizing advanced material sets including projects incorporating embedded electro-optic circuits. Currently as DDi Senior Technologist, responsibilities include: Technical product development and managing the Applications Engineering team. Prior to joining DDi positions included: Director of Technical Marketing for Advanced Interconnection Technology, Manager Applications Engineering for Unistructure Inc. and Manager of Applications Engineering for PCK Technology division of Kollmorgen Corp.

Abstract:This presentation covers Advanced printed circuit technologies that will be essential for the design and development of circuits for chip scale component packages (i.e. array packages 0.8 mm pitch down to flip chip) Subject covered will be advanced imaging and plating techniques, laser drilling, first and second generation microvias, stacked microvias, via-in-pad technologies and solid copper thermal vias all presented in the context of achieving higher density and improved performance.

Bruce Archambeault, PhD, IBM Distinguished Engineer, IEEE Fellow

Speaker Bio: Dr. Bruce Archambeault is an IBM Distinguished Engineer at IBM in Research Triangle Park, NC. He received his B.S.E.E degree from the University of New Hampshire in 1977 and his M.S.E.E degree from Northeastern University in 1981. He received his Ph. D. from the University of New Hampshire in 1997. His doctoral research was in the area of computational electromagnetics applied to real-world EMC problems. Dr. Archambeault has authored or co-authored a number of papers in computational electromagnetics, mostly applied to real-world EMC applications. He is a member of the Board of Directors for the IEEE EMC Society and a past Board of Directors member for the Applied Computational Electromagnetics Society (ACES). Within the IEEE/EMC Society he currently is the Technical Advisory Committee Chair and the Vice President for Conferences. He has served as a past IEEE/EMCS Distinguished Lecturer. He is the author of the book "PCB Design for Real-World EMI Control" and the lead author of the book titled "EMI/EMC Computational Modeling Handbook".

Electromagnetic Band Gap Structures on PCBs to Filter Common Mode noise on high speed differential signal lines

Abstract:High Speed differential signals have become common place in the computer industry. While the use of differential signaling can significantly improve the signal integrity, it does not eliminate EMC concerns. Small amounts of rise/fall time mismatch, in-pair skew, or amplitude mismatch can create significant amounts of common mode signals, which, in turn, cause EMI emissions. Discrete common mode filters are not commonly used due to their impact on the intentional signal as well as their cost. Electromagnetic band gap (EBG) structures can filter unwanted common mode energy without reducing the signal integrity of the intentional signal. This presentation will discuss how to design EBG common mode filters and show their use by simulations and measurements.

Laminates 101